High Frequency Boards

When a PCB becomes more and more complex, certain characteristics of the laminate will play a major role in how the various circuit layers can be aligned:

• Dimensional stability
• Low Z-axis expansion
• Low in-plane expansion coefficient
• Low thermal coefficient of dielectric constant

There are many complexities to how a circuit material may perform in a circuit fabrication environment as well as the end-use performance, and there may be some possible interactions. The material we use have requested characteristics required for High-frequency (RF signal) boards:

• High frequency performance due to tight dielectric tolerance and low loss
• Stable electrical properties versus frequency
• RoHS compliant, environmentally friendly

Coefficient of Thermal Expansion (CTE)

• The linear change in dimension as a function of temperature.